THE SCOPE OF THE CONFERENCE
(Papers are solicited in, but not limited to the following areas)
VLSI Technologies
2 Advanced Process Technologies 3 Advanced Interconnect Technologies 4 Power Devices Technologies 5 2D Devices & Technologies 6 Thin Film Devices and Technologies 7 Compound Semiconductor Technologies 8 Microwave, Millimeter Wave and Analog 9 New Non-Volatile Memory Technologies 10 Flash & 3D Memory Technologies 11 Optoelectronics and Silicon Photonics 12 Sensor, MEMS, and Bioelectronics 13 Emerging Semiconductor Materials & Devices 14 3D Integration 15 Device Technologies for New Computing System 16 Advanced & Heterogeneous Packaging 17 Logic and Power Device Reliability 18 Memory Device Reliability 19 Back-End of Line Reliability & ESD 20 Device Modeling & Simulation 21 Process Modeling & Simulation 22 Design & Technology Co-Optimization |
VLSI Circuits & ICCAD
23 Digital Module & Circuit 24 Analog Module & Circuit 25 Mixed-Signal Circuit & ADC/DACs 26 RF Module & Circuit 27 Memory Circuits 28 SoC For IoT and other applications 29 Processor & Advanced Computing System 30 Efficient AI Circuit 31 Wireline and Optical Communication Circuit 32 FPGA Circuits 33 Advanced Clock 34 Signal Processing 35 Chip Test and Reliablity 36 EDA Technology for Circuit Design
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