Name |
Affiliation |
Country/Region |
Topic |
Jian Fu Zhang |
Liverpool John Moores University |
United Kingdom |
Criteria for Selecting Statistical Distribution for the Amplitude of Random Telegraph Noise |
Hongxia Liu |
Xidian University |
China |
Study on Single-event Effects of 28nm FDSOI Transistors |
Yuchao Yang |
Peking University |
China |
MEMRISTOR CHIPS AND SYSTEMS FOR ENERGY-EFFICIENT LEARNING |
Cher Ming Tan |
Chang Gung University |
Taiwan,China |
3D Electromigration Modelling for VLSI |
Kiat Seng Yeo |
Singapore University of Technology and Design |
Singapore |
Ultra-Low Power 2.4 GHz Receiver Design Techniques for IoT Applications |
Te-Kuang Chiang |
University of Kaohsiung |
Taiwan,China |
An Equivalent Channel Length Model for Junctionless Quadruple-Gate with Gate-Source/Drain Underlap MOSFET and Its Application for Subthreshold Current |
Qing-An Huang |
Southeast University |
China |
Parity-Time Symmetric MEMS |
Meng-fan Chang |
Tsing Hua University |
Taiwan, China |
Design Methodology and Trends of SRAM-Based Compute-in-Memory Circuits |
Liyuan Liu |
Chinese Academy of Sciences |
China |
Design of Programmable Parallel Vision Processor |
Xiaoqing Wen |
Kyushu Institute of Technology |
Japan |
Power-Aware Testing in the Era of IoT |
Man Wong |
The Hong Kong University of Science and technology |
Hongkong, China |
Parallel Dual-Gate Thin-File Transistors for Sensing and Neuromorphic Computing |
Luda Wang |
Peking University |
China |
Atomically Thin Nanoporous Graphene Based Artificial Ion-Selective MEMS Fluidic Devices |
Ngai Wong |
The University of Hong Kong |
Hongkong, China |
A Hardware-Aware Neural Architecture Search Pareto Front Exploration for In-Memory Computing |
Ming Li |
Peking University |
China |
Low-Temperature Recrystallization and Contact Process Technology for 3D Sequential Integration |
Haruo Kobayashi |
Gunma University |
Japan |
Challenges for Waveform Sampling and Related Technologies |
Tzu-Hsien Sang |
Yang Ming Chiao Tung University |
Taiwan,China |
Histogram-based Defogging Techniques for LiDAR |
Weiqiang Liu |
Nanjing University of Aeronautics and Astronautics |
China |
A Survey of Approximation based Hardware Acceleration Techniques for Deep Neural Networks |
Xing Zhou |
Nanyang Technological University |
Singapore |
Efficient SPICE Modeling of Ta2O5-Based Bipolar RRAM Device Including Monte Carlo Simulation |
Minghwei Hong |
Taiwan University |
Taiwan,China |
Perfecting High-κ/Ge and /InGaAs Interfaces - Push for Ultimate CMOS and Emerging Cryogenic Electronic Devices |
Tomoyuki Yokota |
University of Tokyo |
Japan |
Ultra-Flexible Organic Photonic System for Detecting the Bio Signals |
Francis Balestra |
IMEP-LAHC |
France |
Challenges and Possible Solutions for High Performance Sustainable Nanoelectronics |
Yuhui He |
Huazhong University of Science and Technology |
China |
Melting-Free Phase-change Memory for Associative Learning |
Siegfried Selberherr |
Institute for Microelectronics, TU Wien |
United Kingdom |
Design Analysis of Ultra-Scaled MRAM Cells |
Man Wong |
The Hong Kong University of Science and Technology |
Hong Kong, China |
Parallel Dual-Gate Thin-File Transistors for Sensing and Neuromorphic Computing |
Maciej Haras |
Center for Terahertz Research and Applications (CENTERA); Centre for Advanced Materials and Technologies (CEZAMAT) |
Poland |
Further Iot Market Expansion Owing to Innovative Thermal Energy Harvesting |
Bo Zhang |
University of Electronic Science and Technology of China. |
China |
A New Type of Homogenization Field Power Semiconductor Devices |
Mengyuan Hua |
Southern University of Science and Technology |
China |
Recent Progress in GaON for Performance Enhancement of GaN-based Devices |
Mansun Chan |
The Hong Kong University of Science and Technology |
Hong Kong, China |
Hollow Airgap Technology for CMOS Maximum Interconnect Capacitance Reduction |
Hongyu Yu |
Southern University of Science and Technology |
China |
GaN-on-Si Devices and the Application for Power and RF system |
Souvik Mahapatra |
IIT Bombay |
India |
Modeling of Channel Hot Electron Degradation in n-MOSFETs |
Weidong Zhang |
Liverpool John Moores University |
United Kingdom |
Criteria for Selecting Statistical Distribution for the Amplitude of Random Telegraph Noise |
Kuan-Neng Chen |
Yang Ming Chiao Tung University |
Taiwan, China |
Surface Condition Optimization for Low Temperature Oxide Bonding in 3D Integration |
Teruo Suzuki |
Socionext Inc. |
Japan |
CDM Measurement for Bare Dies and Wafers |
Cary Yang |
Santa Clara University |
USA |
Heterostructure-Based Two-Dimensional Wse2 Photodetectors: Devices and Applications |
Chao-Hsin Chien |
Yang Ming Chiao Tung University |
Taiwan, China |
Demonstration of HfO2-Based Gate Stacks with Ultralow Interface State Density and Leakage Current on Ge pMOSFET by Adding Hafnium into GeOx Interfacial Layer |
Hanming Wu |
Zhejiang University |
China |
Challenges and Opportunities of China’s IC Industry in the Post-Moore Era:Role of the Integration between Industry and Education in Supporting the Interdisciplinary Technology Transformation |
Zhichao Tan |
Zhejiang university |
China |
A Review on Direct Digital Conversion for Biomedical Signal Acquisition ICs |
Martin Ziegler |
Technische Universitaet Ilmenau |
Germany |
Lateral 2D TMDC Memristors – Experiment and Modeling |
Yu Cao |
Arizona State University |
USA |
Hybrid IMC Architecture for Robust DNN Acceleration |
Moufu Kong |
University of Electronic Science and Technology of China |
China |
A Novel Heterotype SiC Superjunction MOSFET with Improved Both Forward and Reverse Performance |
Yufeng Guo |
Nanjing University of Posts and Telecommunications |
China |
Current Sensing Interface Based on Noise-Shaped Pulse Width Modulation |
Kyeong-Sik Min |
Kookmin university |
Korea |
Circuit and Training Techniques Compensating for Non-Ideal Effects in Memristor Neural Networks |
Qianqian Huang |
Peking University |
China |
Emerging Ultra-low Power Devices Based on Mechanism Engineering for Diverse Applications |
Runsheng Wang |
Peking University |
China |
Cross-Layer Design for Reliability in Advanced Technology Nodes: An EDA Perspective |
Yibo Lin |
Peking University |
China |
Intelligent and Interactive Analog LayoutDesign Automation |
Yi Zhao |
Zhejiang University |
China |
Ultra-Fast Electrical Characterization of Semiconductor Devices and Its Application in Reliability Study |
Mohamad Sawan |
Westlake University |
China |
A Low-Power Low-Pass Filter for Noise Suppression in Chopped Bioamplifiers |
Qiang Zhao |
Nanjing University of Posts & Telecommunications |
China |
Organic and Flexible Devices Based on Metal-Containing Organic Semiconductors |
Haiding Sun |
University of Science and Technology of China |
China |
Progress on Gallium Nitride-Based HEMT and Phototransistors |
Xing Wu |
East China Normal University |
China |
Sub-3 Nanometer Technology Nodes-based Ultra-thin Gate Stack by in Situ Transmission Electron Microscopy |
Anquan Jiang |
Fudan University |
China |
Multi-Level Storage of Ferroelectric Domain Wall Memory |
Yanli Li |
Fudan university |
China |
A MEOL Logic Layout Optimization Recommendation Under 3 nm CFET Architecture and Beyond |
Xiaona Zhu |
Fudan university |
China |
Design Technology Co-optimization strategy of CFET on Standard Cell Library |
Yuhua Cheng |
Peking University |
China |
An Integrated System Design of Blood Pressure and Electrocardiograph Recordings for Home Healthcare Application |
Xianhe Liu |
Fudan university |
China |
A BEOL Layout Optimization Method for Advanced Logic Standard Library Cells |
Qiang Wu |
Fudan University |
China |
A CDU Budget and Process Window Study with EUV Lithography for 3 nm CFET Logic Processes and an Outlook for Future Generations |
Bo Liu |
Beijing University of Technology |
China |
Graphene and Bi2O2Se based Memristor, Neuromorphic Device and True Random Number Generator |
He Tang |
University Of Electronic Science And Technology Of China |
China |
A Background Calibration Technology for Pipelined ADCs Using Sub-Range Code Bin Reshaping |
Hiroshi Mizuta |
Japan advanced institute of Science and Technology |
Japan |
Sub-10nm Nanomesh Patterned on Suspended Graphene for Nanoscale Thermal Engineering |
Yimao Cai |
Peking University |
China |
Unified Insulator-Metal Transition and Resistive Switching Device for Memory, Computing and Sensing Applications |
Ming He |
Peking University |
China |
Multifunctional Sensors Capable of In-Sensor Data Processing |
You Yin |
Gunma University |
Japan |
Recent Progress in Phase Change Materials and Devices |
Yasuhiko Arakawa |
The University of Tokyo |
Japan |
Silicon Photonics Integrating Quantum Dot Lasers |
Peng Zhou |
Fudan University |
China |
The Road of 2D Semiconductors in Silicon Age |
John Robertson |
Cambridge University |
United Kingdom |
Moire Schottky Barriers for Lower Contact Resistances on layered MoS2 |
Feng Miao |
Nanjing University |
China |
2D Van Der Waals Heterostructures for Neuromorphic Applications |
Hiroshi Iwai |
Yang Ming Chiao Tung University |
Taiwan,China |
History of Transistor Invention: 75th Anniversary |
Huaqiang Wu |
Tsinghua University |
China |
Computing-in-Memory with Memristor: From Material and Deivece Explorations to STCO |