Invited Talks

No.

First
Name

Last
Name

Affiliation

Country /
Region

Topic

1 Yasuhiko Arakawa University of Tokyo Japan

Progress in silicon photonics integrating quantum dot lasers

2 Asen Asenov University of Glasgow UK NESS, the first open source TCAD tool
3 Francis Balestra   

Grenoble INP-Minatec / Sinano Institute

France

Challenges and possible solutions for high performance sustainable Nanoelectronics

4 Yimao Cai Peking  University China  
5 Yu(Kevin) Cao 

Arizona State University

USA

Robust In-Memory Computing for Deep Learning Algorithms

6 Mansun Chan

Hong Kong University of Science & Technology

Hong Kong

3D Airgap Technology for CMOS Interconnect Capacitance Reduction

7

Meng-Fan Chang

National Tsing Hua University

Taiwan

Modeling and Design Methods of SRAM-based Computation-in-Memory Circuits

8 Jingsheng Chen

National University of Singapore

Singapore  
9 Kuan-Neng  Chen NCTU Taiwan

Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration

10 Jiezhi  Chen  Shandong University China 

Extending Flash from Memory to Storage and the Applications for In-memory Computing (IMC)

11 Y.T. Cheng NCTU Taiwan  
12 Yuhua Cheng Peking University China  
13 Chao-Hsin Chien

National Chiao Tung University

Taiwan  
14 Steve Chung 

National Chiao Tung University

Taiwan 

One-Time-Programming Memory in the Era of High-k Metal-gate CMOS Generations

15 Chunqing Deng Alibaba Group China

Toward fault-tolerant superconducting quantum computing systems

16 Dan Fleetwood Vanderbilty University USA

 

17

Ding

Gong

Cogenda Inc.

China

 

18 Yufeng Guo

Nanjing University of Posts and Telecommunications

China

AI-based Design Technology of Semiconductor Power Devices

19 Ming  He Peking University China

Multifunctional Sensors Capable of In-Sensor Data Processing

20 Yuhui He

Huazhong University of Science and Technology

China

Memristive Neural Network for Reinforcement Learning

21 Minghui Hong

National University of Singapore

Singapore  

22

Minghwei

Hong

National Taiwan University

Taiwan

Perfecting high-k/III-V and /Ge interfaces in realizing high-performance MOSFETs for ultimate CMOS and emerging cryogenic electronic devices

23 Weida Hu

Shanghai Institute of Science and Technology

China  
24 Mengyuan Hua UST HK

Recent Progress in GaON for Performance Enhancement of GaN-based Devices

25 Qianqian Huang Peking University China

Hafnia-based ferroelectric devices and applications

26

Qinan Huang Southeast University China

Parity-Time Symmetric MEMS

27 Hiroshi  Iwai

Tokyo Institute of Technology

Japan  
28

Subramanian S.

Iyer UCLA USA

Heterogeneous integration for Flexible Hybrid Electronics

29 Anquan Jiang Fudan University China

Multi-level storage of ferroelectric domain wall memory

30 Gerhard Klimeck Purdue University USA  
31 Haruo Kobayashi Gunma University Japan

Challenge and Issue of Waveform Sampling Method

32 Mario Lanza KAUST

Saudi Arabia

 
33 Tai-Cheng Lee NTU Taiwan  
34 Steven P Levitan Univ. of Pittsburgh USA  
35 Meng Li facebook USA  
36 Ming Li Peking University China

ESD Robustness of Silicon Nanowire Transistor Combined with Thermal Analysis and Optimization

37

Yanli

Li

Fudan University

China

A MEOL and BEOL logic layout optimization recommendation under 3 nm CFET architecture and beyond

38 Lei  Liao Wuhan University China  
39 Yibo Lin Peking University China

Intelligent and Interactive Analog Layout Design Automation 

40

Hongxia

Liu

Xidian University

China

 

41 Weiqiang Liu

Nanjing University of Aeronautics and Astronautics

China

Energy Efficient Approximate Computing Circuits and Systems

42 Xianhe

Liu

Fudan University China

A BEOL layout optimization method for advanced logic standard library cells

43

 Souvik  Mahapatra IIT Bombay  India   
44 Feng Miao Nanjing University China  

45

Giovanni De  Micheli EPFL Swiss

Design automation for superconducting circuits

46 Kyeong-Sik Min  Kookmin Univ. Korea Memory circuits
47 Hiroshi. Mizuta Univ.of Southampton UK  
48 Vojin G Oklobdzija

New Mexico State University

USA  
49 Tianling Ren Tsinghua University China  
50 John Robertson Cambridge UK 

Low contact resistances and Reduced Fermi level pinning to 2D semiconductors using physisorptive Moire Interfaces 

51

Tzu-Hsien Sang NCTU Taiwan

Histogram-based Defogging Techniques for LiDARs

52 Frank Schwierz

Technische Universitaet Ilmenau

Germany

Microwave Transistors – The backbone of 5G and Beyond Communication Systems

53  Siegfried  Selberherr

 Technical University Vienna

Austria

Design Analysis of Ultra-Scaled MRAM Cells

54 Bo Shen Peking University China  
55 Atsushi Shirane

Tokyo Institute of Technology

Japan

Ka-band Phased-Array Transceiver for Satellite Communication (tentative) 

56 Eddy  Simoen IMEC Belgium

FinFETs: Is there an impact on the LF nosie?

57 Adam W.  Skorek University of Quebec Canada

Quantum Computing for Devices Electro-Thermal Modeling and Simulations

58

Thomas Skotnicki

Warsaw University​ of Technology​

Poland  
59 Haiding Sun USTC China

Wide bandgap semiconductor ultraviolet light emitting devices and detectors 

60 Teruo Suzuki  Socionext Inc. USA   Back-End of Line Reliability & ESD
61 Cher Ming Tan  CGU Taiwan  
62 Sheldon Tan

University of California, Riverside

USA

Artificial Intelligence (Process & Device)/ Process Simulation & Modeling        

63 Zhichao  Tan Zhejiang University China

A review on direct digital conversion for biomedical signal acquisition Ics

64 He  Tang UESTC USA

High-Speed High Resolution Pipelined ADC Design

65 Changjin Wan Nanjing University China

Metal-oxide based Device for Neuromorphic Perception Applications

66

Kaiyou Wang

Institute of Semiconductors, CAS

China  

67

Luda

Wang

Peking University

China

Graphene based nanofluidics for molecular transportation

68

Runsheng Wang Peking University China

Design-for-Reliability (DFR) Challenges for Advanced CMOS Technology: Transistor Degradation, Circuit Aging and EDA Tools

69 Zhihua Wang Tsinghua University China

A signal processor and circuits for hearing aiding

70

Xiaoqing Wen

Kyushu Institute of Technology

Japan Power-Aware Testing in the Era of IoT
71 Man Wong

Hong Kong University of Science and Technology

Hong Kong

Parallel Dual-Gate Thin-Film Transistor Technology for the Implementation of Neuromorphic Circuits

72 Ngai Wong  University of HK Hong Kong

A Multi-Objective Loss Function Design for RRAM-based Neural Architecture Search

73 Huaqiang Wu Tsinghua Universit China Progress of Computing in Memristor
74 Nanjian Wu

Institute of Semiconductors, Chinese Academy of Sciences

China

Edge Computing CMOS Vision Chip with Sensing, Memory and Processing Capabilit

75 Qiang Wu Fudan University China

A CDU budget and process window study with EUV lithography for 3 nm CFET logic processes and an outlook for future generations

76 Xing Wu 

East China Normal University

China

In Situ Reliability Study for the sub-5nm Devices

77 Cary Y. Yang Santa Clara University USA WSe2 photodetector
78 J.Joshua Yang

University of Massachusetts, Amherst

USA  
79 Yuchao Yang Peking University China

Memristor Chips and Systems for Energy-Efficient Learning

80 Jiandong Ye  Nanjing University  China

Ga2O3 based bipolar power devices through p-n heterojunction implementation

81 Kiat Seng  Yeo

Singapore University of Technology And Design

Singapore

An ultra-low power 2.4 GHz receiver design techniques for IoT applications

82 You Yin Gunma University Japan Phase change memory
83 Tomoyuki Yokota University of Tokyo Japan

Ultra-flexible organic photonic system for detecting the bio signals.

84 Hong-Yu Yu

Nanyang Technological University

Singapore  CMOS compatible p-GaN HEMT Devices

85

Zhiping Yu Tsinghua University China

Chiplet Design Tool Development for Wafer-Scale Integration Aimed at Brain-Inspired System

86 Bo Zhang

Univ. of Electronic Science and Technology of China

China  
87 J.F. Zhang

Liverpool John Moores University

UK

Criteria for selecting statistical distribution of Random Telegraph Noise 

88 Weidong Zhang

Liverpool John Moores University 

UK

Relaxation in GeSe Ovonic Threshold Switching Device

89 Qiang Zhao

Nanjing University of Posts and Telecommunications

China

Organic and Flexible Devices based on Metal-Containing Organic Semiconductors 

90 Paul Zhou Analog Devices USA

SPICE Latch-up model valid for both transient and static latch-up testing

91 Peng Zhou Fudan University China

The Road of 2D Semiconductors in Silicon Age

92 Xing Zhou

Nanyang Technological University

Singapore

Future III-V/CMOS Co-Integrated Technology and Hybrid Circuit Design

 

More to come, stay tuned!