Organizations

ICSICT 2022 ORGANIZING COMMITTEES

Name

Affiliation

Country
/Area

  Life Honorary Chair

Yangyuan Wang Peking University China

  General Co-Chairs

Jan Van der Spiegel

University of Pennsylvania

USA

Wei Zhang

Fudan University, National IC Innovation Center

China

Bin Zhao

Fairchild

USA

Shaofeng Yu Fudan University, National IC Innovation Center China
Yi Shi Nanjing University China

  Advisory Committee Co-Chairs

Ru Huang

Southeast University

China

Chenming Hu

UC Berkeley

USA

Cor Claeys KU Leuven Belgium

K.N.Tu

UCLA

USA

Mohamad Sawan Westlake University China

  Technical Program Committee Co-Chairs

Fan Ye

Fudan University

China

Xinran Wang

Nanjing University

China

Hiroshi Iwai

Tokyo Institute of Technology

China

Francois Rivet

University of Bordeaux

France

Haruo Kobayashi Gunma University Japan

Yong Lian

Shanghai Jiao Tong University

China

Ming Li

Peking University

China

Yi Zhao 

Zhejiang University

China

  Steering & Organizing Committee Co-Chairs

Mengqi Zhou

IEEE Beijing Section

China

Ting-Ao Tang

Fudan University

China

Huihua Yu

Fudan University

China

  Publicity Co-Chairs

Qiang Wu Fudan University China
Jiting Sheng Fudan University China
Rui Yin National IC Innovation Center China

Min Xu

Fudan University

China

  Secretary General

Xiaona Zhu

Fudan University

China

 

TECHNICAL PROGRAM COMMITTEE (Update Continuously) 

First Name Last Name Affiliation

Country/
Region

Fengwei An Panasonic Semiconductor Solutions Co., Ltd Japan
Fernando Avilla  Herrera Hiroshima University Japan
Francis Balestra Grenoble INP-Minatec / Sinano Institute France
Sandip Bhattacharya Hiroshima University Japan
Yu(Kevin) Cao Arizona State University USA
Mansun Chan Hong Kong University of Science & Technology Hong Kong,
China
C. Y. Chang

National Academy of Engineering, U.S.A. /  Chiao-Tung University

USA/
Taiwan,China
Chip Hong Chang NTU Singapore
Edward Y Chang  Chiao Tung University Taiwan,China
Meng-Fan Chang Tsing Hua University Taiwan,China
Shoujing Chang Applied Research Lab Taiwan,China
An Chen IBM USA
Bing Chen Zhejiang University China
Chih-Hung Chen Mcmaster Univ. Canada
Jiezhi Chen Shandong University China
Jinghong Chen Southern Methodist University USA
Kevin Chen Hong Kong University of Science and Technology Hong Kong,
China
Kuan-Neng Chen Chiao Tung University Taiwan,China
Kunji Chen Nanjing University China
Yong (Nick) Chen University of Macau Macau,China
Y. T. Cheng Chiao Tung University Taiwan,China
Yuhua Cheng Peking University China
Baoyong Chi Tsinghua University China
T.K. Chiang Univ. of Kaohsiung Taiwan,China
Chao-Hsin Chien Chiao Tung University Taiwan,China
Herming Chiueh Chiao Tung University Taiwan,China
Steve Chung Chiao Tung University Taiwan,China
Nadine Collaert IMEC Belgium
Jiyan Dai Polytechnic University Hong Kong,
China
Yann Deval University of Bordeaux France
Shi-Jin Ding Fudan University China
Minoru Fujishima Hiroshima University Japan
Hans-Joachim Gossmann Applied Materials USA
Jifa Hao Fairchild Semiconductor USA
Toshiro Hiramoto University of Tokyo Japan
Minghui Hong National University of Singapore Singapore
Tuo-Hung Hou Chiao Tung University Taiwan,China
Ken Hsieh MXIC Taiwan,China
Guang-Xi Hu Fudan University China
Mengyuan Hua Hong Kong University of Science and Technology Hong Kong,
China
Guocheng Huang ASML USA

Qianqian

Huang

Peking University 

China
CheolSeong Hwang Seoul National University Korea
Kazunari Ishimaru Toshiba Corpration Japan
An-Quan Jiang Fudan University China
Haruo Kobayashi Gunma University Japan
Moufu Kong University of Electronic Science and Technology of China China
Yue Kuo Texas A & M University USA
Kei May Lau Hong Kong University of Science and Technology Hong Kong,
China
Ching-Ting Lee Cheng Kung University Taiwan,China
Frank Lee Synopsys USA
Ming-Hsiu Lee Macronix International Co., Ltd Taiwan,China
Ming Li Peking University China
Xiuyan Li Shanghai Jiao Tong University China
Wenwu Li Fudan University China
Lei Liao Wu Han University China
Chenhsin Lien  Tsing Hua University Taiwan,China
Jyi-Tsong Lin Sun Yat-Sen University Taiwan,China
Yin-Yin Lin Fudan University China
Dongsheng Liu Huazhong University of Science & Technology

China

Han Ting Lue Macronix International Co. Ltd. Taiwan,China
Dongsheng Ma University of Texas at Dallas USA
James Ma ProPlus Design Solutions Inc. USA
Zhenqiang (Jack) Ma University of Wisconsin-Madison USA
Akira Matsuzawa Tokyo Institute of Technology Japan
Carlos Mazure soitec France
Junichi Murota Tohoku University Japan
Wai Tung Ng University of Toronto Canada
Dong Ni Zhejiang University China
Koji Nii Renesas Electronics Corporation Japan
Anthony O'Neill Newcastle University UK
Nobuyuki Otsuka Panasonic Corporation Japan
Liang Qi Shanghai Jiao Tong University China
Xin-Ping Qu Fudan University China
H.F Rashvand Warwick University UK
Seiji Samukawa Tohoku University Japan
Tzu-Hsien Sang Chiao Tung University Taiwan,China
Takashi Sato Kyoto University Japan
Mohamad Sawan Westlake University China
Frank Schwierz Technische Universitaet Ilmenau Germany
Eddy Simoen IMEC Belgium
Thomas Skotnicki

 Institute of High Pressure Physics, Polish Academy of Sciences, and Warsaw University of Technology, Poland

Poland
Teruo Suzuk Socionext Inc. USA
Cher Ming Tan Chang Gung University Taiwan,China
Sheldon Tan University of California, Riverside USA
He Tang UESTC China
Jun Tao Fudan University China
Norman C. Tien Hong Kong University Hong Kong,
China
Akira Toriumi The University of Tokyo Japan
Kingning Tu UCLA USA
Jing Wan Fudan University China
C. C. Wang Sun Yiet Sun University Taiwan,China
Jer Chyi Wang Chang Gung University Taiwan,China
Runsheng Wang Peking University China
Xingang Wang Skyworks USA
Lan Wei Univ. of Waterloo Canada
Man Wong Hong Kong University of Science and Technology Hong Kong,
China
Ngai Wong University of HK Hong Kong,
China
Waisum Wong Hisilicon Com. USA
Jason Woo University of California, Los Angeles USA
Andy Wu Taiwan University Taiwan,China
Nanjian Wu Institute of Semiconductors, Chinese Academy of Sciences China
Qiang Wu Shanghai IC R&D Center China
Yanqing Wu Huazhong Univ. of Science and Technology China
Ya-Hong Xie UCLA USA
Jian Xu the Pennsylvania State University USA
Jian-Bin Xu The Chinese University of Hong kong Hong Kong,
China
Nuo Xu Samsung USA
Yuchao Yang Peking University China
Zaixing Yang Shandong University China
Fan Ye Fudan University China
Peter Ye Purdue University USA
Kiat Seng Yeo Singapore University of Technology and Design Singapore
You Yin Gunma University Japan
Bei Yu Chinese University of HK Hong Kong,
China
Bin Yu State University of New York-Albany USA
HongYu Yu Nanyang Technological University Singapore
Shaofeng Yu Fudan University China
Shimeng Yu ASU USA
Wenjian Yu Tsinghua University China
Zhiping Yu Tsinghua Universiy China
Yi-Qiang Zhan Fudan University China
Haixia Zhang Peking University China
J.F. Zhang Liverpool John Moores University UK
Weidong Zhang Liverpool John Moores University UK
Weisheng Zhao Univ. Paris-Sud, Orsay France
Jia Zhou Fudan University China
Paul Zhou Analog Devices USA
Pingqiang Zhou Shanghai Tech University China
Xing Zhou Nanyang Technological University Singapore
Wenjuan Zhu University of Illinois at Urbana-Champaign USA
Xiaona Zhu Fudan University China
Zhangming Zhu Xidian University China