Organizations

 

ICSICT 2020 Organizing committees

 

Name

Affiliation

Country
/Area

Life Honorary Chair

Yangyuan Wang

Peking University

China

General Co-Chairs

Jan Van der Spiegel

University of Pennsylvania

USA

Bin Zhao

Fairchild

USA

Ting-Ao Tang

Fudan University

China

Wei Zhang Fudan University China
Kun Yue Yunnan University China

Advisory Committee Co-Chairs

Ru Huang

Peking University

China

Chenming Hu

UC Berkeley

USA

T.P. Ma

Yale University

USA

Cor Claeys KU Leuven Belgium

K.N.Tu

UCLA

USA

Technical Program Committee Co-Chairs

Shaofeng Yu

Fudan University

China

Hiroshi Iwai

Tokyo Institute of Technology

Japan

Jason Woo

UCLA

USA 

Yong Lian

Shanghai Jiao Tong University

China

Ching Ting Lee

Yuan Ze University

Taiwan

Ming Li

Peking University

China

Yi Zhao 

Zhejiang University

China

Organizing Committee Co-Chairs

Mengqi Zhou

IEEE Beijing Section

China

Huihua Yu

Fudan University

China

Mingchuan Tan

Yunnan University

China

Publicity Chair

 Min Xu

Fudan University

China

Secretory General

Fan Ye

Fudan University

China

 

Technical Program Committee Members

 

First Name Last Name Affiliation Country/
Region
Fengwei An Panasonic Semiconductor Solutions Co., Ltd Japan
Fernando Avilla  Herrera Hiroshima University Japan
Francis Balestra Grenoble INP-Minatec / Sinano Institute France
Sandip Bhattacharya Hiroshima University Japan
YuKevin Cao Arizona State University USA
Mansun Chan Hong Kong University of Science & Technology Hong Kong
C. Y. Chang National Academy of Engineering, U.S.A. / National Chiao-Tung University USA/Taiwan
Chip Hong Chang NTU Singapore
Edward Y Chang National Chiao Tung University Taiwan
Meng-Fan Chang National Tsing Hua University Taiwan
Shoujing Chang National Applied Research Lab Taiwan
An Chen IBM USA
Bing Chen Zhejiang University China
Chih-Hung Chen Mcmaster Univ. Canada
Jiezhi Chen Shandong University China
Jinghong Chen Southern Methodist University USA
Kevin Chen Hong Kong University of Science and Technology Hong Kong
Kuan-Neng Chen NCTU Taiwan
Kunji Chen Nanjing University China
Yong (Nick) Chen University of Macau Macau
Y. T. Cheng NCTU Taiwan
Yuhua Cheng Peking University China
Baoyong Chi Tsinghua University China
T.K. Chiang National Univ. of Kaohsiung Taiwan
Chao-Hsin Chien National Chiao Tung University Taiwan
Herming Chiueh Taiwan Chiao Tong University Taiwan
Steve Chung National Chiao Tung University Taiwan
Nadine Collaert IMEC Belgium
Jiyan Dai Polytechnic University Hong Kong
Yann Deval University of Bordeaux France
Shi-Jin Ding Fudan University China
Minoru Fujishima Hiroshima University Japan
Hans-Joachim Gossmann Applied Materials USA
Jifa Hao Fairchild Semiconductor USA
Toshiro Hiramoto University of Tokyo Japan
Minghui Hong National University of Singapore Singapore
Tuo-Hung Hou National Chiao Tung University Taiwan
Ken Hsieh MXIC Taiwan
Guang-Xi Hu Fudan University China
Mengyuan Hua Hong Kong University of Science and Technology Hong Kong
CheolSeong Hwang Seoul National University Korea
Kazunari Ishimaru Toshiba Corpration Japan
An-Quan Jiang Fudan University China
Haruo Kobayashi Gunma University Japan
Moufu Kong University of Electronic Science and Technology of China China
Yue Kuo Texas A & M University USA
Kei May Lau Hong Kong University of Science and Technology Hong Kong
Ching-Ting Lee National Cheng Kung University Taiwan
Frank Lee Synopsys USA
Ming-Hsiu Lee Macronix International Co., Ltd Taiwan
Ming Li Peking University China
Lei Liao Wu Han University China
Chenhsin Lien National Tsing Hua University Taiwan
Jyi-Tsong Lin National Sun Yat-Sen University Taiwan
Yin-Yin Lin Fudan University China
Han Ting Lue Macronix International Co. Ltd. Taiwan
Dongsheng Ma University of Texas at Dallas USA
James Ma ProPlus Design Solutions Inc. USA
Zhenqiang (Jack) Ma University of Wisconsin-Madison USA
Akira Matsuzawa Tokyo Institute of Technology Japan
Carlos Mazure soitec France
Junichi Murota Tohoku University Japan
Wai Tung Ng University of Toronto Canada
Dong Ni Zhejiang University China
Koji Nii Renesas Electronics Corporation Japan
Anthony O'Neill Newcastle University UK
Nobuyuki Otsuka Panasonic Corporation Japan
Xin-Ping Qu Fudan University China
H.F Rashvand Warwick University UK
Seiji Samukawa Tohoku University Japan
Tzu-Hsien Sang NCTU Taiwan
Takashi Sato Kyoto University Japan
Frank Schwierz Technische Universitaet Ilmenau Germany
Eddy Simoen IMEC Belgium
Thomas Skotnicki Institute of High Pressure Physics, Polish Academy of Sciences, and Warsaw University of Technology, Poland Poland
Teruo Suzuk Socionext Inc. USA
Cher Ming Tan CGU Taiwan
Sheldon Tan University of California, Riverside USA
He Tang UESTC USA
Jun Tao Fudan University China
Norman C. Tien Hong Kong University HK
Akira Toriumi The University of Tokyo Japan
Kingning Tu UCLA USA
Jing Wan Fudan University China
C. C. Wang National Sun Yiet Sun University Taiwan
Jer Chyi Wang Chang Gung University Taiwan
Runsheng Wang Peking University China
Xingang Wang Skyworks USA
Lan Wei Univ. of Waterloo Canada
Man Wong Hong Kong University of Science and Technology Hong Kong
Ngai Wong University of HK Hong Kong
Waisum Wong Hisilicon Com. USA
Jason Woo University of California, Los Angeles USA
Andy Wu NTU Taiwan
Nanjian Wu Institute of Semiconductors, Chinese Academy of Sciences China
Qiang Wu Shanghai IC R&D Center China
Yanqing Wu Huazhong Univ. of Science and Technology China
Ya-Hong Xie UCLA USA
Jian Xu the Pennsylvania State University USA
Jian-Bin Xu The Chinese University of Hong kong Hong Kong
Nuo Xu Samsung USA
Yuchao Yang Peking University China
Zaixing Yang Shandong University China
Peter Ye Purdue University USA
Kiat Seng Yeo Singapore University of Technology and Design Singapore
You Yin Gunma University Japan
Bei Yu Chinese University of HK Hong Kong
Bin Yu State University of New York-Albany USA
HongYu Yu Nanyang Technological University Singapore
Shimeng Yu ASU USA
Wenjian Yu Tsinghua University China
Zhiping Yu Tsinghua Universiy China
Yi-Qiang Zhan Fudan University China
Haixia Zhang Peking University China
J.F. Zhang Liverpool John Moores University UK
Weidong Zhang Liverpool John Moores University UK
Weisheng Zhao Univ. Paris-Sud, Orsay France
Jia Zhou Fudan University China
Paul Zhou Analog Devices USA
Pingqiang Zhou Shanghai Tech University China
Xing Zhou Nanyang Technological University Singapore
Wenjuan Zhu University of Illinois at Urbana-Champaign USA
Xiaona Zhu Fudan University China
Zhangming Zhu Xidian University China

 

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