Organizations

ICSICT 2018 Organizations

Name

Affiliation

Country
/Area

Life Honorary Chair

Yangyuan Wang

Peking University

China

General Co-Chairs

Cor Claeys

KU Leuven

Belgium

Bin Zhao

Fairchild

USA

Ting-Ao Tang

Fudan University

China

Advisory Committee Co-Chairs

Ru Huang

Peking University

China

Chenming Hu

UC Berkeley

USA

T.C. Chen

IBM

USA

K.N.Tu

UCLA

USA

Technical Program Committee Co-Chairs

Yu-Long Jiang

Fudan University

China

Hiroshi Iwai

Tokyo Institute of Technology

Japan

J. J. Liou

University of Central Florida

USA

Jason Woo

UCLA

USA

 

Yong Lian

York University

UK

Yi Zhao

Zhejiang University

China

Ming Li

Peking University

China

Qing-Tai Zhao 

PGI 9, Forschungszentrum Juelich

Germany

 

 

 

Organizing Committee Co-Chairs

Mengqi Zhou

IEEE Beijing Section

China

 

Huihua Yu

Fudan University

China

Zhaojun Lin

Shandong University

China

     

Publicity Chair

 

 

 

 

 

 

Secretory General

Fan Ye

Fudan University

China

 

 

 

 

Technical Program Committee Members

 

First Name

Last Name

Affiliation

Country/Region

Akira

Matsuzawa

Tokyo Institute of Technology

Japan

Akira

Toriumi

The University of Tokyo

Japan

An

Chen

IBM

USA

Andy

Wu

NTU

Taiwan

An-Quan

Jiang

Fudan University

China

Anthony

O'Neill

Newcastle University

UK

Baoyong

Chi

Tsinghua University

China

Bei

Yu

Chinese University of HK

Hong Kong

Bin

Yu

State University of New York-Albany

USA

Bing

Chen

Zhejiang University

China

C. C.

Wang

National Sun Yiet Sun University

Taiwan

C. Y.

Chang

National Academy of Engineering, U.S.A.

/ National Chiao-Tung University

USA/Taiwan

Carlos

Mazure

soitec

France

Cezhou

Zhao

xjtlu

China

Chao-Hsin

Chien

National Chiao Tung University

Taiwan

Chaojiang

Li

IBM

USA

Chenhsin

Lien

National Tsing Hua University

Taiwan

CheolSeong

Hwang

Seoul National University

Korea

Cher Ming

Tan

CGU

Taiwan

Chih-Hung

Chen

Mcmaster Univ.

Canada

Ching-Ting

Lee

National Cheng Kung University

Taiwan

Chip Hong

Chang

NTU

Singapore

Dong

Ni

Zhejiang University

China

Dongsheng

Ma

University of Texas at Dallas

USA

Eddy

Simoen

IMEC

Belgium

Edward Y

Chang

National Chiao Tung University

Taiwan

Fengwei

An

Panasonic Semiconductor Solutions Co., Ltd

Japan

Fernando

Avilla  Herrera

Hiroshima University

Japan

Francis

Balestra

Grenoble INP-Minatec / Sinano Institute

France

Frank

Schwierz

Technische Universitaet Ilmenau

Germany

Frank

Lee

synopsys

USA

Guang-Xi

Hu

Fudan University

China

H.F

Rashvand

Warwick University

UK

Haixia

Zhang

Peking University

China

Han Ting

Lue

Macronix International Co. Ltd.

Taiwan

Hans-Joachim

Gossmann

Applied Materials

USA

Haruo

Kobayashi

Gunma University

Japan

He

Tang

UESTC

USA

Herming

Chiueh

Taiwan Chiao Tong University

Taiwan

HongYu

Yu

Nanyang Technological University

Singapore

J.F.

Zhang

Liverpool John Moores University

UK

James

Ma

ProPlus Design Solutions Inc.

USA

Jason

Woo

University of California, Los Angeles

USA

Jer Chyi

Wang

Chang Gung University

Taiwan

Jia

Zhou

Fudan University

China

Jian

Xu

the Pennsylvania State University

USA

Jian-Bin

Xu

The Chinese University of Hong kong

Hong Kong

Jiezhi

Chen

Shandong University

China

Jifa

Hao

Fairchild Semiconductor

USA

Jing

Wan

Fudan University

China

Jinghong

Chen

Southern Methodist University

USA

Jiyan

Dai

Polytechnic University

Hong Kong

Jun

Tao

Fudan University

China

Junichi

Murota

Tohoku University

Japan

Jyi-Tsong

Lin

National Sun Yat-Sen University

Taiwan

Kazunari

Ishimaru

Toshiba Corpration

Japan

Kei May

Lau

Hong Kong University of Science and Technology

Hong Kong

Ken

Hsieh

MXIC

Taiwan

Kevin

Chen

Hong Kong University of Science and Technology

Hong Kong

Kiat Seng

Yeo

Singapore University of Technology and Design

Singapore

Kingning

Tu

UCLA

USA

Koji

Nii

Renesas Electronics Corporation

Japan

Kuan-Neng

Chen

NCTU

Taiwan

Kunji

Chen

Nanjing University

China

Lan

Wei

Univ. of Waterloo

Canada

Lei

Liao

Wu Han University

China

Man

Wong

Hong Kong University of Science and Technology

Hong Kong

Mansun

Chan

Hong Kong University of Science & Technology

Hong Kong

Meng-Fan

Chang

National Tsing Hua University

Taiwan

Mengyuan

Hua

Hong Kong University of Science and Technology

HK

Ming

Li

Peking University

China

Ming-Hsiu

Lee

Macronix International Co., Ltd

Taiwan

Minghui

Hong

National University of Singapore

Singapore

Minoru

Fujishima

Hiroshima University

Japan

Nadine

Collaert

IMEC

Belgium

Nanjian

Wu

Institute of Semiconductors, Chinese Academy of Sciences

China

Ngai

Wong

University of HK

Hong Kong

Nobuyuki

Otsuka

Panasonic Corporation

Japan

Norman C.

Tien

Hong Kong University

HK

Nuo

Xu

Samsung

USA

Paul

Zhou

Analog Devices

USA

Peter

Ye

Purdue University

USA

Pingqiang

Zhou

Shanghai Tech University

China

Runsheng

Wang

Peking University

China

Sameer

Sonkusale

Tufts University

USA

Sandip

Bhattacharya

Hiroshima University

Japan

Seiji

Samukawa

Tohoku University

Japan

Sheldon

Tan

University of California, Riverside

USA

Shi-Jin

Ding

Fudan University

China

Shimeng

Yu

ASU

USA

Shoujing

Chang

National Applied Research Lab

Taiwan

Steve

Chung

National Chiao Tung University

Taiwan

T.K.

Chiang

National Univ. of Kaohsiung

Taiwan

Takashi

Sato

Kyoto University

Japan

Teruo

Suzuk

Socionext Inc.

USA

Thomas

Skotnicki

Institute of High Pressure Physics, Polish Academy of Sciences, Poland and Warsaw University of Technology, Poland

Poland

Toshiro

Hiramoto

University of Tokyo

Japan

Tuo-Hung

Hou

National Chiao Tung University

Taiwan

Tzu-Hsien

Sang

NCTU

Taiwan

Wai Tung

Ng

University of Toronto

Canada

Waisum

Wong

Hisilicon Com.

USA

Weidong

Zhang

Liverpool John Moores University

UK

Weisheng

Zhao

Univ. Paris-Sud, Orsay

France

Wenjian

Yu

Tsinghua University

China

Wenjuan

Zhu

University of Illinois at Urbana-Champaign

USA

Xiaowu

Gong

Infineon Technologies Asia Pacific Pte Ltd

China

Xing

Zhou

Nanyang Technological University

Singapore

Xingang

Wang

Skyworks

USA

Xin-Ping

Qu

Fudan University

China

Y. T.

Cheng

NCTU

Taiwan

Ya-Hong

Xie

UCLA

USA

Yann

Deval

University of Bordeaux

France

Yanqing

Wu

Huazhong Univ. of Science and Technology

China

Yin-Yin

Lin

Fudan University

China

Yi-Qiang

Zhan

Fudan University

China

You

Yin

Gunma University

Japan

YuKevin

Cao

Arizona State University

USA

Yuchao

Yang

Peking University

China

Yue

Kuo

Texas A & M University

USA

Yuhua

Cheng

Peking University

China

Zaixing

Yang

Shandong University

China

Zhangming

Zhu

Xidian University

China

Zhenqiang (Jack)

Ma

University of Wisconsin-Madison

USA

Zhiping

Yu

Tsinghua Universiy

China


 

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